Compared with CNC processing equipment, the fragile material non-taper picosecond laser cutting machine has no consumables, no pollution, and high production efficiency (several times the processing efficiency of CNC) during the production process, which greatly saves production and manufacturing costs for processing manufacturers. , Improve product profit.
Power | 50W (optional 10W, 30W, 50W, 75W, 100W and above) |
Wavelength | 1064nm, beam quality: M2<1.3 |
Pulse length | <10PS; Pulse frequency: 1Hz-1000kHz |
Cooling method | Water cooling |
Focus spot | <2um |
Cutting speed | 0-300mm/s adjustable |
Cutting thickness | ≤10mm (different materials may affect the processing thickness, thicker can be cut by multiple cutters) |
Minimum cutting edge chipping | <5um |
Cutting accuracy | ≤±20um, the highest precision of equipment cutting is ±5um |
X/Y cutting stroke | 450mm x600mm, single platform (360X400 single head dual platform optional, 500mmX600mmSingle head double platform, 600x700 cutting + split double platform) |
X/Y moving speed | Maximum 1000mm/s, acceleration 1G |
X/Y positioning accuracy | ≤±2μm |
X/Y repeat positioning accuracy | ≤±1um |
Z axis travel | 50mm |
Z-axis focus positioning resolution | 1um |
Precision | ≤±3μm |
Voltage, power | AC220V±5%,L+N+E , <4KW |
Ambient temperature | 18-28℃ |
Relative humidity | 10-70% (on the principle of non-condensing), clean environment |